RoHS豁免即將取消?---RoHS2.0豁免條款評(píng)估最近進(jìn)展

發(fā)表時(shí)間:2015-09-11 17:21

利益相關(guān)方將對(duì)電子電氣產(chǎn)品中有害物質(zhì)限制(RoHS 指令)豁免申請(qǐng)進(jìn)行評(píng)議,時(shí)間從2015年8月21日至2015年10月16日持續(xù)8周,這次評(píng)議涵蓋對(duì)附件III中的29條豁免條款的申請(qǐng)。

通測(cè)檢測(cè)提醒廣大客戶,RoHS 2.0的豁免與電子電氣相關(guān)行業(yè)產(chǎn)生影響巨大,利益相關(guān)方的評(píng)議結(jié)果將對(duì)未來豁免條款是否繼續(xù)生效有直接影響,確切的信息將會(huì)在歐盟網(wǎng)站上公布,請(qǐng)盡快開展供應(yīng)鏈調(diào)查,以便標(biāo)準(zhǔn)實(shí)施時(shí)能夠及時(shí)應(yīng)對(duì)。

評(píng)議申請(qǐng)豁免清單

The review list applying for exemption

豁免清單(the exemption list)

1(a-e)

單端(緊湊)熒光燈中的汞含量不得超過(每燈):

Mercury in single capped (compact) fluorescent lamps not exceeding (per burner):

(a)

一般照明用途,小于30W: 5mg

For general lighting purposes < 30 W: 5 mg

(b)

一般照明用途,30 W≤功率<50W5mg

For general lighting purposes ≥ 30 W and < 50 W: 5 mg

(c)

一般照明用途,50 W≤功率<150W5mg

For general lighting purposes ≥ 50 W and < 150 W: 5 mg

(d)

一般照明用途,功率≥150W15mg

For general lighting purposes ≥ 150 W: 15 mg

(e)

一般照明用途,圓形或者方形結(jié)構(gòu),且管直徑≤17mm

For general lighting purposes with circular or square structural shape and tube diameter ≤ 17 mm

1(f)

特殊用途:5mg

For special purposes: 5 mg

2(a)(1-5)

用于一般照明用途的雙端線性熒光燈中汞的含量不超過(每燈):

Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp):

(1)

正常壽命的三基色粉和管直徑<9mm(如T2):5mg

Tri-band phosphor with normal lifetime and a tube diameter < 9 mm (e.g. T2): 5 mg

(2)

正常壽命的三基色粉和9mm≤管直徑≤17mm(如T5):5mg

Tri-band phosphor with normal lifetime and a tube diameter ≥ 9 mm and ≤ 17 mm (e.g. T5): 5 mg

(3)

正常壽命的三基色粉和17mm<管直徑≤28mm(如T8):5mg

Tri-band phosphor with normal lifetime and a tube diameter > 17 mm and ≤ 28 mm (e.g. T8): 5 mg

(4)

正常壽命的三基色粉和管直徑>28mm(如T12):5mg

Tri-band phosphor with normal lifetime and a tube diameter > 28 mm (e.g. T12): 5 mg

(5)

長(zhǎng)壽命(≥25000小時(shí))的三基色粉:8mg

Tri-band phosphor with long lifetime (≥ 25 000 h): 8 mg

2(b)(3)

管直徑>15mm的非線性三基色粉燈(T9):15mg

Non-linear tri-band phosphor lamps with tube diameter > 15 mm (e.g. T9)

2(b)(4)

其他一般照明和特殊用途的燈(如感應(yīng)燈):15mg

Lamps for other general lighting and special purposes (e.g. induction lamps): 15 mg per lamp

3(a-c)

特殊用途的冷陰極熒光燈和外部電極熒光燈中汞的含量不超過(每燈):

Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp):

(a)

短尺寸(≤500mm):3.5mg

Short length (≤ 500 mm): 3.5 mg per lamp

(b)

中等尺寸(>500mm≤1500mm):5mg

Medium length (> 500 mm and ≤ 1 500 mm): 5 mg per lamp

(c)

長(zhǎng)尺寸(大于1500mm):13mg

Long length (> 1 500 mm): 13 mg per lamp

4(a)

其他低壓放電燈中汞的含量(每燈):15mg

Mercury in other low pressure discharge lamps (per lamp): 15 mg per lamp

4(b) (I-III )

一般照明用途的高壓鈉(蒸汽)燈,改進(jìn)顯色指數(shù)Ra>60,其中汞含量不超過:

Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra > 60:

I

P≤155W 30mg

P ≤ 155 W: 30 mg per burner

II

155W<P≤405W 40mg

155 W < P ≤ 405 W: 40 mg per burner

III

P>405W 40mg

P > 405 W: 40 mg per burner"

4(c)(I-III )

一般照明用途的其他高壓鈉(蒸汽)燈中的汞含量不超過(每燈):

Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner):

I

P≤155W 25mg

P ≤ 155 W: 25 mg per burner

II

155W<P≤405W 30mg

155 W < P ≤ 405 W: 30 mg per burner

III

P>405W 40mg

P > 405 W: 40 mg per burner

4(e)

金屬鹵化燈中汞的含量。

Mercury in metal halide lamps (MH)

4(f)

未在此附錄中特別提及的用于特殊用途的其他放電燈中汞的含量

Mercury in other discharge lamps for special purposes not specifically mentioned in this

Annex

5(b)

熒光管的玻璃內(nèi)的鉛含量不超過其重量的0.2%

Lead in glass of fluorescent tubes not exceeding 0.2 % by weight

6(a)

加工用途的鋼和鍍鋅鋼中合金元素中的鉛的重量比不超過0.35%

Lead as an alloying element in steel for machining purposes and in galvanised steel containing up to 0.35 % lead by weight

6(b)

鋁里,鉛的重量比不超過0.4%

Lead as an alloying element in aluminium containing up to 0.4 % lead by weight

6(c)

銅合金中,鉛的重量比不超過4%

Copper alloy containing up to 4 % lead by weight

7(a)

高溫融化焊料中的鉛(即:鉛含量大于或等于85%的鉛基合金)

Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead)

7(c)-I

電子電氣元件的玻璃或陶瓷中的鉛或玻璃或陶瓷基混合物中的鉛,電容器的介電陶瓷除外,如壓電陶瓷裝置

Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound

7(c)-II

額定電壓125V AC或者250V DC或更高的電容器的介電陶瓷中的鉛

Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC

or higher

7(c)-IV

集成電路或分立式半導(dǎo)體的電容器部件中使用的PZT介電陶瓷材料中的鉛

Lead in PZT based dielectric ceramic materials for capacitors which are part of integrated circuits or discrete semiconductors

8(b)

電氣觸點(diǎn)中的鎘及鎘化合物

Cadmium and its compounds in electrical contacts

9

在吸收式電冰箱中作為碳鋼冷卻系統(tǒng)的防腐劑的六價(jià)鉻的重量比不超過0.75%

Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0.75 % by weight in the cooling solution

15

集成電路倒裝芯片封裝中半導(dǎo)體芯片及載體之間形成可靠聯(lián)接所用焊料中的鉛

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages

18(b)

當(dāng)放電燈被用作含磷光粉的仿日曬燈,比如含有BSP (BaSi2O5 :Pb),放電燈中的熒光粉觸媒劑的鉛含量在其重量的1%或以下

Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi 2 O 5 :Pb)

21

用在玻璃表面瓷釉,如硅酸鹽玻璃和堿石灰玻璃上的印刷油墨中的鉛和鎘

Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses

24

通孔盤狀及平面陣列陶瓷多層電容器焊料所含的鉛

Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors

29

理事會(huì)指令69/493/EEC 附件I(第1、2、3 4 類)中定義的水晶玻璃中的鉛

Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC ( 1 )

32

窗體裝配中,用于氬和氪激光管的密封玻璃中的氧化鉛

"Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes

34

金屬陶瓷質(zhì)的微調(diào)電位器元件中的鉛

Lead in cermet-based trimmer potentiometer elements

37

以硼酸鋅玻璃體為基材的高壓二極管的電鍍層的鉛

Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body



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